This is the first cleanup pass through makefiles and pios.
Probably it is difficult to track changes due to the nature of them.
I would recommend to look at resulting files and compiled code instead.
NOTE: original branch was rebased and lot of conflicts were fixed on
the way. So do not expect that every commit in this series will be
buildable (unlike original branch). Only final result was tested.
The main goal was to remove as much duplication of code (and copy/paste
errors) as possible, moving common parts out of Makefiles. It still is
not perfect, and mostly no code changes made - Makefiles and #ifdefs only.
But please while testing make sure that all code works as before, and no
modules/options are missed by accident.
Brief list of changes:
- Moved common parts of Makefiles into the set of *.mk files.
- Changed method of passing common vars from top Makefile to lower ones.
- Some pios cleanup, mostly #ifdefs, and all pios_config.h files.
- Many obsolete files removed (for instance, AHRS files, op_config.h).
- Many obsolete or unused macros removed or fixed/renamed (ALL_DIGNOSTICS).
- Unified pios_config.h template. Please don't remove lines for board
configs, only comment/uncomment them. Adding new PIOS options, please
propagate them to all board files keeping the same order.
- Some formatting, spacing, indentation (no line endings change yet).
- Some cosmetic fixes (no more C:\X\Y\filename.c printings on Windows).
- Added some library.mk files to move libs into AR achives later.
- EntireFlash target now uses cross-platform python script to generate bin
files. So it works on all supported platforms: Linux, OSX, Windows.
- Top level packaging is completely rewritten. Now it is a part of top
Makefile. As such, all dependencies are checked and accounted, no
more 'make -j' problems should occur.
- Default GCS_BUILD_CONF is release now, may be changed if necessary
using 'make GCS_BUILD_CONF=debug gcs'.
- GCS build paths are separated into debug and release, so no more obj
file clashes. Packaging system supports only release builds.
- New target is introduced: 'clean_package'. Now 'make package' does not
clean build directory. Use clean_package instead for distributable builds.
- Targets like 'all', 'opfw_resource', etc now will print extra contex
in parallel builds too.
- If any of 'package', 'clean_package', 'opfw_resource' targets are given
on command line, GCS build will depend on the resource, so all fw_*.opfw
targets will be built and embedded into GCS. By default GCS does not
depend on resource, and will be built w/o firmware (unless the resource
files already exist and the Qt resource file is generated).
- fw_simposix (ELF executable) is now packaged for linux. Run'n'play!
- Make help is refined and is now up to date.
Still broken:
- UnitTests, should be fixed
- SimPosix: buildable, but should be reworked.
Next planned passes to do:
- toolchain bootstrapping and packaging (including windows - WIP)
- CMSIS/StdPeriph lib cleanup
- more PIOS cleanup
- move libs into AR archives to save build time
- sim targets refactir and cleanup
- move android-related directories under <top>/android
- unit test targets fix
- source code line ending changes (there are many different, were not changed)
- coding style
Merging this, please use --no-ff git option to make it the real commit point
Conflicts:
A lot of... :-)
Inconsistent use of debug macros in board definition files resulted in
BU compilation error. It was attempted to use PIOS_COM_SendFormattedStringNonBlocking()
directly even if PIOS_COM was not included (like for BootloaderUpdater).
So this function in pios_debug.c was replaced by DEBUG_PRINTF() macro.
The macro itself is defined in pios_debug.h file. Its definitions are
removed from board files. And to use it one has to define in pios_config.h:
#define PIOS_INCLUDE_DEBUG_CONSOLE
#define DEBUG_LEVEL <number>
in addition to PIOS_INCLUDE_COM with aux port.
Conflicts:
flight/PiOS/Boards/STM32103CB_PIPXTREME_Rev1.h
flight/PiOS/Boards/STM32F4xx_RevoMini.h
Summary of changes:
* USB CDC and HID drivers are completely split apart.
* This will allow different max buffer sizes for HID and CDC.
* USB descriptors have been overhauled:
* Proper structs/macros/enums declared for USB (see pios_usb_defs.h)
* Two common descriptor definitions. One for HID+CDC another for HID only.
See pios_usb_desc_{hid_cdc,hid_only}.c for details.
* Long standing bugs in OP USB descriptors became much more obvious with the
new struct definitions.
* Board specific USB initialization is now in pios_usb_board_data.h in each build target.
* Definition of USB descriptors is now entirely indpendent of STM32 libs.
Glue into STM32 libs is provided by pios_usbhook.c.
* Removed a lot of stale/irrelevant USB #defines throughout the tree.
* Improved naming consistency throughout USB code:
* PIOS_USB_HID_* now refers to the HID endpoint code.
* PIOS_USB_CDC_* now refers to the CDC endpoint code.
* PIOS_USB_* now refers to the low-level USB code.
* PIOS_USB_BOARD_* now refers to board-specific USB data
* PIOS_USBHOOK_* is glue between PIOS and STM32 USB libs.
* struct usb_* and enum usb_* and USB_* and HID_* are all types from the USB spec.
* Shrunk the buffer size on the CDC call mgmt endpoint to save some RAM.
* Made a few more USB related variables static to save some RAM.
This allows the spektrum and sbus receiver drivers to bind
directly to the usart layer using a properly exported API
rather than overriding the interrupt handler.
Bytes are now pushed directly from the usart layer into the
com layer without any buffering. The com layer performs all
of the buffering.
A further benefit from this approach is that we can put all
blocking/non-blocking behaviour into the COM layer and not
in the underlying drivers.
Misc related changes:
- Remove obsolete .handler field from irq configs
- Adapt all users of PIOS_COM_* functions to new API
- Fixup callers of PIOS_USB_HID_Init()
Now that every bootloader build has a board info blob,
make all fw and bl images use it.
The following MACROS are removed:
BOARD_TYPE, BOARD_REVISION, BOOTLOADER_VERSION,
START_OF_USER_CODE, HW_TYPE
These values are now ONLY available from the bootloader
flash via the pios_board_info_blob symbol. These values
must not be #defined or otherwise hard-coded into the
firmware in any way. The bootloader flash is the only
valid source for this information.
NOTE: To ensure that we have an upgrade path from an
old bootloader (without board_info_blob) to a
new bootloader (with board_info_blob), it is
essential that the bu_* targets do not depend
on (or validate) the board_info_blob being present
in the bootloader flash.
The USE_BOOTLOADER compile flag was only being used
to determine where the ISR vector table was located.
Provide this explicitly from the linker since it knows
exactly where it is putting the ISR vector table.
The board info blob is stored in the last 128 bytes of the
bootloader's flash bank. You can access this data from the
application firmware like this:
#include <pios_board_info.h>
if (pios_board_info_blob.magic == PIOS_BOARD_INFO_BLOB_MAGIC) {
/* Check some other fields */
}
DO NOT link pios_board_info.c into your application firmware.
Only bootloaders should provide the content for the board info
structure. The application firmware is only a user of the data.
